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No-Clean Flux Residue and In-Circuit Test During wave soldering, most of the flux from that process is consumed or washed off the bottom side of the board when in contact with the molten solder wave. However, if no-clean flux residue seeps between the pallet and the board, it will not be removed by the wave process. Any remaining residue, if covering in-circuit test pads, may be an impediment to proper incircuit test probe contact. Care should be taken to minimize flux deposition for wave soldering. In terms of board design, test pads should be moved as far from intended wave-solder pallet openings as possible.

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Notice that we have made use of assumption 4 in writing the last term of Eq. (21. lo), which implies that the metal in the outer jacket wall is always at the steam temperature. A mass balance on the steam side of the kettle yields

Designing PWBs for Wave Soldering Complex PCAs with BGAs and fine-pitch SMT components on boards thicker than about 2.36 mm (0.093 in.) may be difficult to wave-solder if care in layout is not observed.

Use appropriate heat relief It is good design practice to use appropriate heat reliefs (e.g., spoked pads) to provide electrical conduction but limit thermal conduction from the PTHs to ground or power planes internal to the board (see Fig. 47.27). This will enhance heatup of the PTH and limit thermal sinking to the ground or power planes and thus also enhance PTH barrel fill if process parameters are correct.

(21.11)

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FIGURE 47.27 Schematic of a thermal relief feature within a PWB. The spokes connect to the PTH to the conduction plane and limit thermal transfer. The limited thermal path enhances heating of the PTH for soldering.

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Limit the number or plane attachments Where possible, limit the number of ground or power plane attachments to a PTH barrel. Each attachment point will result in thermal dissipation into the copper plane. This lost heat will detract from the soldering process making the job of pre-heating and solder wetting all the more difficult. Cluster components and provide clearance Group wave-soldered PTH components together. Avoid interspersing nonwave soldered SMD components within PTH fields. Conversely, avoid designs that place an isolated PTH component amid a field of SMD components. Such a placement requires a small wave pallet opening that inhibits solder-wave fluid flow, pre-heating, and wave contact. Place the components properly in relation to edges and use selvage edges When possible, avoid placing PTH components directly against the edge of the board. There must be clearance from the board edge to the pallet to allow the board to nest within the pallet.A selvage edge (a removable and disposable board edge extension that is part of the board itself) can be designed into the PWB (see Fig. 47.28). After wave soldering, the selvage edge can be removed by rotary cutter or routing. Note that post-solder routing is not preferred, especially for no-clean soldered assemblies. The abrasive router dust may remain within connectors and scratch connector contact surfaces or mating connector contacts. The vibration from routing may also affect the reliability of certain components.

FIGURE 47.28 Board schematic showing a removable selvage edge, a disposible edge to enable wave soldering of the PTH connector near the true edge of the board.

W (H, - H,) = (U, - H,)Vfg + tTqCl%

Avoid double-sided wave-soldered PTH components Double-sided wave soldering is generally fraught with defects. Determine whether SMT or press-fit technology can be used to replace a second wave-soldering operation. The industry-standard preference is to restrict all wave-solderable components to one side (components inserted through the primary side) of the PWB. Do not place components near gold fingers Clearance from gold fingers is required so as not to contact the gold fingers with solder. The gold finger should be away from the pallet nest edges. Covering the gold fingers with an acrylic-based high-temperature adhesive tape will help to keep solder and flux from the gold fingers. The tape is not an effective mask if exposed directly to the solder wave.

There are many types of wave-soldering systems, each with its unique advantage as claimed by the manufacturer.The soldering engineer has to assess these improvements as they relate to the type of assembly being soldered. The technology has matured significantly, but the degree of equipment complexity attests to the complexity of the process.There are many process variables associated with this operation. If these are not understood or properly controlled, wave-soldering defects such as skip soldering (electrical opens) and bridges (electrical shorts) will occur as in any other soldering operation. Another important defect is the influence of secondary-side wave soldering on primary-side surface-mounted components. If parameters are not controlled properly, it is possible to cause primary-side SMDs to reach reflow temperatures.This can induce

+ UA(T, - To) dUv + VP,dt (21.12)

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